VCSEL chips die are bare vertical‑cavity surface‑emitting laser dies from Raysees. Covering single‑/multi‑emitter, regular/random‑array, addressable single‑/multi‑junction types, they span low CW milliwatt to ultra‑high pulse‑driven hundred‑watt optical power for LiDAR, 3D sensing and industrial vision systems

Product Details

Modern optical sensing systems require diversified VCSEL light‑source specifications for different scenarios. Raysees VCSEL chips die deliver a comprehensive product portfolio, containing single‑emitter and multi‑emitter VCSELs with regular‑pattern or random‑pattern emitter arrays. It also provides single‑junction and multi‑junction VCSEL dies with addressable control function. 

The product range covers full optical‑power spectrum, ranging from several‑milliwatt low‑power CW operation to hundreds‑watt ultra‑high‑power pulse‑driven output, adapting to consumer, automotive and industrial laser‑sensing projects.

Key Features

1. Rich complete portfolio supplies single‑emitter and multi‑emitter VCSEL bare die for diverse light‑source requirements 

2. Offer flexible emitter‑array layout choices of regular pattern and random pattern 

3. Support addressable‑control single‑junction and multi‑junction VCSEL die chips 

4. Realize wide optical‑power range covering low‑power CW mW‑level up to pulse‑driven hundreds‑watt ultra‑high power 

5. Meet technical demands of 3D sensing, LiDAR, consumer electronics and industrial vision 

6. Available bare‑die laser components for optical‑module manufacturers and bulk OEM procurement projects