Silicon compound substrate is a high-performance semiconductor base material with ultra-high thermal conductivity, excellent mechanical stability and comprehensive chemical resistance, customized for high-power electronic and semiconductor industrial scenarios.

Product Details

High-power semiconductor and automotive electronics industries demand stable heat dissipation and low-loss substrate materials. This silicon compound substrate delivers ultra-high thermal conductivity over 100W/(m.k) for efficient heat release. It features low expansion coefficient, high structural strength and outstanding resistance to high temperature, chemical corrosion and high pressure. 

With low dielectric loss, it ensures stable electrical performance. Ideal for semiconductor modules and automotive electronic equipment, it improves product stability and service life in high-power operation.

Key Features

1. Ultra-high thermal conductivity above 100W/(m.k) ensures efficient heat dissipation 

2. Low expansion coefficient and high strength guarantee structural stability 

3. Excellent resistance to high temperature, chemical corrosion and high pressure 

4. Low dielectric loss maintains stable electrical signal performance 

5. Premium material solution for semiconductors and high-power devices 

6. Widely applicable to automotive electronics and high-power module industries