A high-performance semiconductor material with excellent thermal conductivity, low coefficient of expansion, high strength and excellent resistance to high temperature and chemical corrosion, suitable for high-power electronic devices, automotive electronics, semiconductor packaging and other harsh environments.

Product Features

Product Market Advantage:  

 High thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical resistance, high pressure resistance, low dielectric loss, etc. Thermal conductivity>100W/(m.k).   

Application Function:   

Semiconductor material solutions, widely used in automotive electronics, high power devices, semiconductors, high power modules and other areas.